| PART |
Description |
Maker |
| 21-0542 |
PACKAGE OUTLINE 12 BUMPS, WLP PKG, 0.4MM PITCH
|
Maxim Integrated Products
|
| SC70-6 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| WLCSP3X3-9 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3.5X3.5-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP3X4-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| TDFN3X3-14 |
Package Outline
|
Global Mixed-mode Techn...
|
| TDFN3X4-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|
